Micro-Electronic Technology Co., Ltd. Chongqing Pu professional design and processing a variety of optical communication devices backlit pads, PD carrier, MPD carrier, the transition board, ceramic heat sink, etc., for all types of lasers, detectors, transmitters, optical amplifiers, etc. optoelectronic devices in the chip mount pad products, and the terminal connections, and can mount resistors and capacitors and other components. 
 Ceramic substrate thickness: 0.15,0.25,0.3,0.38,0.5,0.635,0.8,1.0,1.2,1.5 mm optional; 
 Carrier material: aluminum oxide (AL2O3) ceramic, aluminum nitride (ALN) ceramics, glass, silicon, ferrite series; 
 Metal layer materials: Ni, Cr, Ti, TiW, NiV, NiCr alloy, AL, Cu, Au, etc. 
 Minimum processing size: 0.2 × 0.2mm; 
 Gold-plated mode: single, double, side. 
 High precision, high reliability and wide range of applications, can meet different user requirements under various environments. 
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 Fax: 
 Email: cqweipu @ 
 Contact: Wang Xu